Monday, March 28, 2011

New pics from my decapping project

In the first two pics you can see the damage been made by the drill i used. Only a fraction has been revealed with the drill and the rest was made with nitric acid.
Both of the mcu's were damaged because i used a small tweezer to clean up the excess debris without the ultrasonic cleaner.
Lesson learned: No more tools inside until the whole wafer is exposed. I have to be careful with the drill too.

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